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  4. WL 2 in1 CPU NAND BGA Reballing Stencil Platfrom for iPhone 6, 6S,7, 8,X, XR, XS, Xs, Max

WL 2 in1 CPU NAND BGA Reballing Stencil Platfrom for iPhone 6, 6S,7, 8,X, XR, XS, Xs, Max

Reference: BG0052-G269966422

Condition: New product

0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working,
it is the top quality BGA Reballing Stencil for iphone CPU and NAND, A9 / A8 /A10/A11/A12
WL Top quality Fast Speed BGA reballing Solder template stencil

Note:
When you purchase this product for the first time, you must first purchase the magnetic base
Magnetic base + positioning plate + tin mesh （Together to use,)

149 Items

$3.69

The minimum purchase order quantity for the product is 10

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